차세대 디스플레이 연구센터(ADRC)는
디스플레이 연구분야에 있어서 세계를 선도하고 있습니다.
총 42개의 공정이 등록되어 있습니다. 검색하실 공정명이나 사양을 입력하시고 검색을 클릭하세요.
a-Si:H deposition
PECVD System
(Plasma-enhanced chemical vapor deposition)
Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS
Substrate size : < 15cm X 15cm
Deposition thickness : Max 200 nm/Time
SiNx, SiO₂ deposition
PECVD System
(Plasma-enhanced chemical vapor deposition)
Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS
Substrate size : < 15cm X 15cm
Deposition thickness : Max 200 nm/Time
PIN deposition
PECVD System
(Plasma-enhanced chemical vapor deposition)
Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS
Substrate size : < 15cm X 15cm
Deposition thickness : Max 700 nm/Time
Cu, Ti, Mo, Al, IZO, ITO deposition
DC sputtering system
Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS
Substrate size : < 15cm X 15cm
Deposition thickness : Max. 200 nm/Time
Ag, Ni, Ti depositions
[Manual sputter]
Company : SAM WON Vacuum
Substrate size : < 15cm X 15cm
Target size : 8-inch
Material : Ag, Ni, Ti
Vacuum gauge : 10-5 Torr
Thickness : Max. 100 nm/time
Ion Shower Doping System
p- or n-doping for amorphous and crystal silicon
P-doping (B2H6), N-doping (PH3)
Model. No. : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS
Substrate size : < 15cm X 15cm
Photo-lithography
Size
1. Mask : 8-inch
2. Substrate : < 15cm X 15cm)
3. Procedure : PR coating → Photo-lithography → Develop → Etch → Strip
Dry Etch System
Reactive Ion Etching (RIE)
Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS
Substrate size : < 15cm X 15cm
Wet Etch System
Wet station
Metal : Cu, Ti, Mo, Al, IZO, ITO
Insulator : SiO2, SiNx
Semiconductor : a-Si:H, LTPS, IGZO
Substrate size : < 15cm X 15cm
Baking System
Soft and Hard bakes for Photo-resist or solution process
Oven type
Company : Clean Oven
Model. No. : OF-11s
Soft baker : 110℃
Hard baker : 130℃
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