Backplane TFT

보유공정 소개 Introduction for ADRC process

에이디알씨는 디스플레이 연구분야에 있어서 세계를 선도하고 있습니다.

  총 40개의 공정이 등록되어 있습니다. 검색하실 공정명이나 사양을 입력하시고 검색을 클릭하세요.
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a-Si:H deposition
PECVD System
(Plasma-enhanced chemical vapor deposition)

Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS

Substrate size : < 15cm X 15cm
Deposition thickness : Max 200 nm/Time
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SiNx, SiO₂ deposition
PECVD System
(Plasma-enhanced chemical vapor deposition)

Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS

Substrate size : < 15cm X 15cm
Deposition thickness : Max 200 nm/Time
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Cu, Ti, Mo, Al, IZO, ITO deposition
DC sputtering system

Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS

Substrate size : < 15cm X 15cm
Deposition thickness : Max. 200 nm/Time
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Ag, Ni, Ti depositions
[Manual sputter]
Company : SAM WON Vacuum
Substrate size : < 15cm X 15cm
Target size : 8-inch
Material : Ag, Ni, Ti
Vacuum gauge : 10-5 Torr
Thickness : Max. 100 nm/time
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PIN deposition
PECVD System
(Plasma-enhanced chemical vapor deposition)

Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS

Substrate size : < 15cm X 15cm
Deposition thickness : Max 700 nm/Time
㈜ 에이디알씨
서울특별시 동대문구 이문로 12, 601 (우산빌딩)
TEL. 02-961-0753  |  개인정보관리책임자 : ADRC  |  E-mail : sales@adrc2000.com
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